6

A bubble-activated micropump with high-frequency flow reversal

Année:
2010
Langue:
english
Fichier:
PDF, 1.74 MB
english, 2010
13

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

Année:
2016
Langue:
english
Fichier:
PDF, 2.44 MB
english, 2016